by Xinfei Guo and Mircea R. Stan
Publisher | Springer Nature |
Language | English |
Book type | Paperback |
Utgiven | 2020-08-14 |
Edition | 1 |
Pages | 208 |
ISBN | 9783030200534 |
Kategori(er) |
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models.
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